Multilayer PCB

HASL: Hot air solder spraying is a step and process flow in the production process of multilayer PCB. Specifically, immerse the PCB into the molten solder pool, so that all exposed copper surfaces will be covered by solder, and then remove the excess solder on the PCB through a hot-air cutter. Because the surface of the circuit board after tin spraying is the same material as the solder paste, the welding strength and reliability are good. However, due to its processing characteristics, the surface flatness of tin spraying treatment is not good, especially for small electronic components such as BGA. Due to the small welding area, if the flatness is poor, it may cause problems such as short circuit. Therefore, a process with good flatness is needed to solve the problem of tin spraying plate. Generally, the gold plating process will be selected (note that it is not the gold plating process), and the principle and method of chemical replacement reaction will be used for reprocessing to increase the nickel layer with a thickness of about 0.03 ~ 0.05um or 6um to improve the surface flatness.

PCB Standard: IPC-A-610 D

Supply Ability
Supply Ability: 500000 Piece/Pieces per month
Packaging & Delivery
Packaging Details
PCB: Vacuum Packing with Carton Box 
PCBA: ESD Packing with Carton Box
Shipping service: By EMS/DHL/FEDEX/UPS/SEA
Port: ShangHai  
Payment Method: T/T; Paypal; Western Union; MoneyGram
Product cost :  0.1 USD-8 USD 


Product Description
Electronic printed circuit board(Multilayer PCB)
1: Support 48 hours make the sample, In general, smaples need 3-5 working days, mass production need 8-12 working days.
2. MOQ is 1 PCS. produce rigid FR4,1-48 layer PCB.
3. Mini Line width / space:0.15mm, Minin drill holes:0.3mm
4. Pass through ISO9001/SGS/ROHS certificate
5. Support OEM design, Send us gerber file.

Application：

http://www.rcpcba1.com/